99.995% Pure Titanium Plate Titanium Sputtering Target

99.995% Pure Titanium Plate Titanium Sputtering Target

  99.995% Pure Titanium Plate Titanium Sputtering Target

 

Titanium Sputtering Target of Product Description

    Titanium is recognized for its high strength-to-weight ratio. It is a strong metal with low density that is quite ductile (especially in an oxygen-free environment), lustrous, and metallic-white in color. The relatively high melting point (more than 1,650 °C or 3,000 °F) makes it useful as a refractory metal. It is paramagnetic and has fairly low electrical and thermal conductivity.

 

·Titanium Sputtering Target of specification

product name

99.995% Pure Titanium Plate Titanium Sputtering Target

Purity

99.995%

Color

Grayish White, Lustrous, Metallic

Sputter

DC

Size

Tube/ Plate, Customized

Processing Method

Smelting and casting

Service

Target Bonding with Indium

 

  Other Metal Targets

 

 

Formula

Name

Purity

Formula

Name

Purity

Al

Aluminum Target

5N-5N5

Nb

Niobium Target

3N5-4N

B

Boron Target

3N

Ni

Nickel Target

3N5-5N

Bi

Bismuth Target

4N-5N

NiCr

Nickel Chromium

3N 3N5

Ca

Calcium Target

2N5

Pb

Plumbum Target

5N

Cd

Cadmium Target

4N

Sb

Antimony Target

4N

Co

Cobalt Target

3N5

Se

Selenium Target

4N

Cr

Chromium Target

2N5-3N5

Si

Silicon Target

5N

CrAl

Chromium Aluminum

3N

Sn

Tin Target

4N

Cu

Copper Target

4N-6N

Ta

Tantalum Target

3N5-4N

Fe

Iron Target

3N5

Te

Tellurium Target

4N

Ge

Germanium Target

5N

Ti

Titanium Target

2N5-5N

Hf

Hafnium Target

3N5

TiAl

Titanium Aluminum

3N

In

Indium Target

4N5

V

Vanadium Target

3N

Li

Lithium Target

3N

W

Tungsten Target

3N5-5N

Mg

Magnesium Target

3N5-4N

WTi

Tungsten Titanium

3N-4N

Mn

Manganese Target

3N

Zn

Zinc Target

4N5

Mo

Molybdenum Target

3N5-4N

Zr

Zirconium Target

2N5-3N5

Titanium Sputtering Target of introduction 

 our company specializes in producing high density, ultra high purity (99.9% to 99.9999%) metal sputtering targets for all applications using both vacuum melt/casting and hot isostatic pressing (HIP) technology. Sputtering targets are available monoblock or bonded with dimensions up to 1500 mm. Research-sized targets are also available, as are custom sizes and alloy compositions.

All targets are analyzed using best demonstrated techniques including X-Ray Fluorescence (XRF), Glow Discharge Mass Spectrometry (GDMS) and Inductively Coupled Plasma (ICP).

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