High purity W Sputtering Target Tungsten target 99.95%

High purity W Sputtering Target Tungsten target 99.95%

Specification of W Sputtering Target

 

JX metal specializes in producing high purity Tungsten Sputtering Targets with the highest possible density and smallest possible average grain sizes for use in semiconductor, chemical vapor deposition (CVD) and physical vapor deposition (PVD) display and optical applications.

 

Our standard Sputtering Targets for thin film are available monoblock or bonded with planar target dimensions and configurations up to 820 mm with hole drill locations and threading, beveling, grooves and backing designed to work with both older sputtering devices as well as the latest process equipment, such as large area coating for solar energy or fuel cells and flip-chip applications. Research sized targets are also produced as well as custom sizes and alloys.

 

All targets are analyzed using best demonstrated techniques including X-Ray Fluorescence (XRF), Glow Discharge Mass Spectrometry (GDMS), and Inductively Coupled Plasma (ICP). "Sputtering" allows for thin film deposition of an ultra high purity sputtering metallic or oxide material onto another solid substrate by the controlled removal and conversion of the target material into a directed gaseous/plasma phase through ionic bombardment.

 

We can also provide targets outside this range in addition to just about any size rectangular, annular, or oval target. Materials are produced using crystallization, solid state and other ultra high purification processes such as sublimation.

1. Grade: W1

2. Purity :> =99.95%

3. Characteristic:

Melting Point: 3410°C

Boiling Point:5927°C

Density: 19.3g/cm3

High quality, workability

4. Certificate: ISO9001:2008

5. Product Feature: High melting point, High-density, high temperature oxidation resistance, long service life, resistance to corrosion..

6. More details about tungsten target

As-rolled Surface Finish

Ground Surface Finish

Minimum Thickness

0.125”+/-0.020”

Minimum Thickness

0.125”+/-0.005”

Maximum Width

12”

Maximum Width

12”

Maximum Length

24”

Maximum Length

24”

Maximum Thickness

0.400”+/-0.030”

Maximum Thickness

0.400”+/-0.005”

Maximum Width

12”

Maximum Width

12”

Maximum Length

12”

Maximum Length

12”

7.Application: Sputtering targets are wildly used in decorative coating industry, semiconductor, electronic, displayer, solar energy, Integrated circuit, optical element, Function coating, Surface decoration, Glass coating, micro-electronics, Miniature components, Optical communication, Medical devices and so on

 

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